| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric integrated package module capable of achieving low power consumption and low noise.SOLUTION: A photoelectric integrated package module includes: a silicon interposer 60 in which electrical wiring 41 and an optical waveguide 42 are formed on a silicon substrate 43; an optical semiconductor element 50 formed in the interposer 60, electrically connected to the electrical wiring 41, and optically coupled to the optical waveguide 42; an integrated circuit chip 10 having a logic circuit; and an integrated circuit chip 20 in which the chip 10 is mounted on a first primary surface side and a second primary surface side is mounted on the interposer 60, and driving the optical semiconductor element 50. The chips 10 and 20 are electrically connected through via wiring 21 formed inside the chip 20 from the first primary surface, and the chip 10 or 20 receives an electrical signal by a non-terminated receiving circuit through the via wiring 21. |
