METHOD FOR MANUFACTURING HIGH-STRENGTH TITANIUM-COPPER FOIL

摘要

PROBLEM TO BE SOLVED: To provide a high-strength titanium-copper foil which is suitable as a conductive spring material used in electronic apparatus components, such as an auto focus camera module.SOLUTION: A titanium-copper foil contains 1.5-5.0 mass% of Ti and the remainder comprises copper and inevitable impurities. The titanium-copper foil has a 0.2% proof stress in a direction parallel to a rolling direction of not less than 1,100 MPa and an arithmetic average roughness (Ra) in a direction orthogonal to a rolling direction of not more than 0.1 μm.