| 摘要 |
A contact surface (242a) of a locking protrusion (242) is formed into an inclined surface on which a printed circuit board (10) moves away from a substrate connector (20) as the diameter of a connector locking opening (14) increases. The thickness of the printed circuit board (10) is set smaller than the separation distance between the base end (242b) of the contact surface (242a) and a standoff protrusion (23). The diameter of the connector locking opening (14) is set such that the protruding length of a solder terminal (21) from a through-hole (11) matches a desired value. |
