| 摘要 |
<p>The purpose of the present invention is to provide a component packaging device and a component packaging method which enable shifting to component pressure-bonding work while preventing a component mounted on a substrate from falling. While a substrate (2) is placed on a substrate placement stage (53) provided in a central substrate transfer unit (33C), the substrate (2) is transferred to a component mounting work unit (22b), after work for mounting a component (4) on the substrate (2) has been performed by the component mounting work unit (22b), the central substrate transfer unit (33C) is moved to the side of a first component pressure-bonding work unit (22c) to thereby transfer the substrate (2) that remains placed on the substrate placement stage (53) to the first component pressure-bonding work unit (22c), and the component (4) is pressure-bonded to the substrate (2) by the first component pressure-bonding work unit (22c).</p> |
