LAMINATE SHEET, CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE

摘要

The present invention is a laminate sheet (100) obtained by laminating, in the following order, a first prepreg (201) containing a first glass fiber base material layer (101), one or more layers of a second prepreg (202) containing an organic base material layer and not containing a glass fiber base material layer, and a third prepreg (203) containing a second glass fiber base material layer (102).