| 摘要 |
<p>A process for manufacturing a semiconductor device through an inlined operation includes the step of attaching a dicing tape to the ground surface immediately after the completion of the grinding of the reverse side. The dicing tape includes a base material and, undetachably laminated thereon, an adhesive layer that includes an adhesive component and an epoxy group-containing compound being free but that does not contain any hardener for epoxy resins.</p> |
