| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy which has a low melting point, exhibits excellent mechanical characteristics such as durability, crack resistance, corrosion resistance, and can suppress generation of a void (air gap), and provide a solder paste containing the solder alloy, and an electronic circuit board obtained by using the solder paste.SOLUTION: A tin-silver-copper solder alloy contains tin, silver, copper, bismuth, nickel, and cobalt. A content ratio of the silver with respect to a total amount of the solder alloy is 2-4 mass%. A content ratio of the nickel is 0.01-0.15 mass%. A content ratio of cobalt is 0.001-0.008 mass%. |
