EPOXY RESIN COMPOSITION AND HEAT DISSIPATION CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having a novel composition and to provide a heat dissipation circuit board having improved thermal efficiency.SOLUTION: The epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin including a crystalline epoxy, a curing agent and an inorganic filler. The heat dissipation circuit board according to an embodiment of the present invention comprises a metal plate, an insulation layer formed on the metal plate and a circuit pattern formed on the insulation layer and the insulation layer is formed by curing the epoxy resin composition comprising the epoxy resin including a crystalline epoxy, the curing agent and the inorganic filler.