| 摘要 |
<p>The purpose of the present invention is to provide a sensor device having improved reliability. The sensor device is provided with: a sensor element which comprises an underlayer insulating film formed on a substrate, a detection section formed on the underlayer insulating film, a wiring line drawn from the detection section, and an overlayer insulating film formed on the wiring line; and a mold resin which has an exposed part that is formed by partially covering the sensor element with the mold resin so as to expose a detection-section-formed surface of the sensor element. In the sensor device, a wiring line-removed part from which the wiring line is partially removed at an end part of the exposed part is formed.</p> |
