发明名称 WIRING SUBSTRATE
摘要 <p>A wiring substrate is provided with an insulating base layer, an insulating layer stacked on the base layer, and a conductive connection terminal. The insulating layer has a first surface in which an opening is formed, a second surface which is recessed to the base layer side with respect to the first surface within the opening, and a wall surface which connects the first surface and the second surface along the stacking direction of the insulating layer with respect to the base layer within the opening. The connection terminal is exposed from the second surface. The second surface has a deepest point located closest to the base layer side in the second surface, is curved in a convex shape to the base layer side, and connects the wall surface and the connection terminal. The relationship between the length (L1) between the wall surface and the deepest point along a layer surface direction orthogonal to the stacking direction and the length (L2) between the deepest point and the connection terminal along the layer surface direction satisfies L1>L2.</p>
申请公布号 WO2014030309(A1) 申请公布日期 2014.02.27
申请号 WO2013JP04722 申请日期 2013.08.05
申请人 NGK SPARK PLUG CO., LTD. 发明人 NISHIDA, TOMOHIRO;MORI, SEIJI;WAKAZONO, MAKOTO
分类号 H01L21/60 主分类号 H01L21/60
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