发明名称 HIGH-FREQUENCY CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency circuit module capable of preventing sneaking of a transmission signal to a reception circuit, and of having a high packaging density.SOLUTION: A first duplexer 110 related to a first frequency band is mounted on a circuit board 200, and a second transmission filter 122 and a second reception filter 124 configuring a second duplexer 120 related to a second frequency band are embedded and provided in the circuit board 200. The second transmission filter 122 and the second reception filter 124 are embedded and provided at a position at least partially overlapped with a projection region provided in the circuit board and formed by projecting the first duplexer 110 in a thickness direction of the circuit board. The first frequency band and the second frequency band are separated from each other by a predetermined frequency or more.
申请公布号 JP2014039265(A) 申请公布日期 2014.02.27
申请号 JP20130178324 申请日期 2013.08.29
申请人 TAIYO YUDEN CO LTD 发明人 SAJI TETSUO;NAKAMURA HIROSHI
分类号 H04B1/50;H05K3/46 主分类号 H04B1/50
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