发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 A method for manufacturing a PCB includes certain steps. A printed circuit board sheet is provided. The printed circuit board includes an unwanted portion and a printed circuit board unit which includes a plurality of contact pads. An imaginary boundary line is defined between the printed circuit board unit and the unwanted portion. Each of the contact pads defines an outline. A nearest distance between the outline and the imaginary boundary line is less than 4 millimeters. The printed circuit board sheet is punched along the imaginary boundary line, forming one hollow portion or a plurality of through slots. A plurality of burrs is generated on an inner surface of the hollow portion or the through slots. The burrs are removed using a low-energy laser cutting process, thereby obtaining a printed circuit board. A laser power used in the low-energy laser cutting process is 5-8 watts.
申请公布号 US2014053397(A1) 申请公布日期 2014.02.27
申请号 US201313974382 申请日期 2013.08.23
申请人 ZHEN DING TECHNOLOGY CO., LTD.;FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. 发明人 LIU RUI-WU;LEE YU-HSIEN;YU WEN-HSIN
分类号 H05K3/00 主分类号 H05K3/00
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