发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
摘要 A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.
申请公布号 US2014054074(A1) 申请公布日期 2014.02.27
申请号 US201313858102 申请日期 2013.04.08
申请人 FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.;ZHEN DING TECHNOLOGY CO., LTD. 发明人 SHEN FU-YUN;WANG ZHI-TIAN;MING BO
分类号 H05K1/09;H05K3/10 主分类号 H05K1/09
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