The present invention relates to a semiconductor package capable of protecting a semiconductor chip or a passive device included therein from external forces and minimizing the expansion of a ground layer at the same time. For this, the semiconductor package according to the present invention includes: a substrate which includes at least one ground layer; and at least one electronic component which is mounted on one side of the substrate. The ground layer includes an expansion receiving unit which receives an expanded part when the ground layer is thermally expanded.
