| 摘要 |
A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC. |
