| 摘要 |
PROBLEM TO BE SOLVED: To hold a semiconductor device by suction even when the semiconductor device is mounted with components to vicinity of a substrate end.SOLUTION: A suction head 10 comprises a suction sheet 11 provided on the side of sucking a BGA (Ball Grid Array semiconductor device) 100 and a suction jig 12 which is stacked on the suction sheet 11 and has an interior space 12d. Here, the suction sheet 11 has an elastic force higher than that of the suction jig 12. Further, the suction sheet 11 includes a plurality of sheet holes 11c which pierce the suction sheet 11 in a thickness direction in an arrangement similar to that of solder balls 102. The suction jig 12 includes a plurality of jig holes 12c which are communicated with a plurality of the sheet holes 11c respectively and the interior space 12d. The BGA 100 is adsorbed such that the solder balls 102 block the sheet holes 11c and the interior space 12d communicating with the sheet holes 11c and the jig holes 12c is sucked by a suction apparatus. |
