| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a semiconductor work-piece having front and back sides.SOLUTION: A method comprises: i) a process, in which a back side is placed on a work-piece supporting part so that a front side faces a chamber for processing, and in which the chamber has a chamber gas pressure and the back side is in fluid connection with a back side area having a back pressure; ii) a process, in which the work-piece is processed under conditions of a first chamber pressure of Pand a first back pressure of P, and in which pressure difference P-Pis generated and maintained in order to prevent a contact failure caused by pressure between the work-piece and the work-piece supporting part; and iii) a process, in which the work-piece is cooled under conditions of a second chamber pressure of Pand a second back pressure of P, in which Pand Pare larger than Pand P, in which Pis large enough to promote the cooling of the work-piece, and in which a pressure difference P-Pis generated and maintained in order to prevent the contact failure caused by pressure between the work-piece and the work-piece supporting part. |
