| 摘要 |
The invention relates to a pane (I) having a connection element (3), at least comprising - a substrate (1) having an electrically conductive structure (2) on at least a subregion of the substrate (1), - the electrical connection element (3) on at least a subregion of the electrically conductive structure (2), and - a lead-free soldering compound (4) which connects the electrical connection element (3) to the electrically conductive structure (2) in at least a subregion, wherein the lead-free soldering compound (4) contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper. |
