| 摘要 |
A sealing structure has: a plate portion that is formed with a harder material than a bendable substrate and interposes an electronic device via the substrate from a top surface and a back surface of the substrate on which the electronic device is mounted; and an elastic body that is provided on an outer periphery of the plate portion to cover a part of the plate portion and integrally molded so as to press the plate portion against the substrate. |
