| 摘要 |
<p>The present invention is characterized by including the processes of: partial screen printing so as to form a solder resist on at least one surface of a printed circuit board through a silk-screen printing method using PSR-type ink; heat-drying the PSR ink, wherein the printed circuit board on which the PSR-type ink has been applied is heat-dried for 15 to 70 minutes at 130 to 160°C; marking printing in which UV ink or IR ink is applied for printing a number or a letter on at least one surface of the printed circuit board on which the PSR ink has been applied; and drying the marking printing, wherein ultraviolet light is emitted for 5 to 30 seconds to dry a marking printing site in the event UV ink is used in the marking printing process, and the printed circuit board is heat-dried for 10 to 30 minutes at 130 to 160°C in the event IR ink is used in the marking printing process.</p> |
