发明名称 Manufacturing apparatus for depositing a material on an electrode for use therein
摘要 The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. A contact region coating is disposed on the contact region of the exterior surface of the electrode. The contact region coating has an electrical conductivity of at least 9x106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte.
申请公布号 AU2009236678(B2) 申请公布日期 2014.02.27
申请号 AU20090236678 申请日期 2009.04.13
申请人 HEMLOCK SEMICONDUCTOR CORPORATION 发明人 KNAPP, THEODORE;HILLABRAND, DAVID
分类号 H05B3/03;C01B33/035;C23C16/44 主分类号 H05B3/03
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