发明名称 |
Manufacturing apparatus for depositing a material on an electrode for use therein |
摘要 |
The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. A contact region coating is disposed on the contact region of the exterior surface of the electrode. The contact region coating has an electrical conductivity of at least 9x106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte. |
申请公布号 |
AU2009236678(B2) |
申请公布日期 |
2014.02.27 |
申请号 |
AU20090236678 |
申请日期 |
2009.04.13 |
申请人 |
HEMLOCK SEMICONDUCTOR CORPORATION |
发明人 |
KNAPP, THEODORE;HILLABRAND, DAVID |
分类号 |
H05B3/03;C01B33/035;C23C16/44 |
主分类号 |
H05B3/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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