发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method, which can prevent decrease in breakdown voltage between a gate and a drain and make a high-voltage DMOS transistor deliver sufficient performance.SOLUTION: A DMOS gate insulation film 22 of a semiconductor device 1 in which an HV-DMOS 2, an HV-CMOS 3 and an LV-CMOS 4 are provided on a common semiconductor substrate 5 comprises: a first insulation film 14 which is formed in a part outside of a DMOS channel region 17 and which is the same in thickness with each of an HV-nMOS gate insulation film 35 and an HV-pMOS gate insulation film 47; and a second insulation film 15 which is formed in a part on the DMOS channel region 17 and which is the same in thickness with each of an LV-nMOS gate insulation film 54 and an LV-pMOS gate insulation film 63.
申请公布号 JP2014038965(A) 申请公布日期 2014.02.27
申请号 JP20120181158 申请日期 2012.08.17
申请人 ROHM CO LTD 发明人 SEKIGUCHI YUJI
分类号 H01L21/8234;H01L21/336;H01L21/8238;H01L27/088;H01L27/092;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/8234
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