| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having good characteristics.SOLUTION: A semiconductor device has a digital pad part DPD electrically connected to a digital MOS which composes a power supply circuit or a control circuit, and an RF pad part electrically connected to an RF MOS which composes a circuit for high-frequency amplification. The semiconductor device comprises a protection element ESD which is provided under the digital pad part DPD and electrically connected to the digital pad part DPD and the protection element ESD is not provided under the RF pad part. With this configuration, electrostatic discharge at the digital pad part DPD is improved. In addition, by arranging the protection element ESD under the digital pad part DPD, an area of an element formation region can be decreased. Further, since the protection element ESD is not arranged under the RF pad part, noise caused by parasitic capacitance can be reduced. |
