| 摘要 |
PROBLEM TO BE SOLVED: To improve the connection reliability of a wire under a cooling/heating cycle environment in electronic equipment in which a substrate on which an element or the like is loaded is electrically connected to a lead by a wire.SOLUTION: The electronic equipment includes: a base member (11); a substrate (13) fixed to one surface (15a, 6a) of the base member; a lead (12) fixed to the base member; and a wire (14) for electrically connecting the substrate and the lead on one face side of the base member. The lead includes: a base fixing part (20) fixed to the base member; a spring part (21) disposed so as to be flexibly deformable; a wire connection part (22) to which the wire is connected; and a substrate fixing part (23) fixed to the substrate. The base fixing part, the spring part, the wire connection part and the substrate fixing part are disposed in this order, and the spring part is configured so as to be elastically deformable in a first direction which is orthogonal to the thickness direction of the substrate. |
