发明名称 METHOD OF FORMING THIN RESISTIVE HEATING LAYER, HEATING MEMBER INCLUDING THE THIN RESISTIVE HEATING LAYER, AND FUSING UNIT INCLUDING THE HEATING MEMBER
摘要 A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
申请公布号 US2014053393(A1) 申请公布日期 2014.02.27
申请号 US201313930624 申请日期 2013.06.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SANG-EUI;KIM HA-JIN;KIM DONG-EARN;KIM DONG-OUK;PARK SUNG-HOON;BAE MIN-JONG;SON YOON-CHUL;CHU KUN-MO
分类号 H05B3/00;G03G15/20;H05B3/10;H05B3/40 主分类号 H05B3/00
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