发明名称 |
METHOD OF FORMING THIN RESISTIVE HEATING LAYER, HEATING MEMBER INCLUDING THE THIN RESISTIVE HEATING LAYER, AND FUSING UNIT INCLUDING THE HEATING MEMBER |
摘要 |
A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation. |
申请公布号 |
US2014053393(A1) |
申请公布日期 |
2014.02.27 |
申请号 |
US201313930624 |
申请日期 |
2013.06.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE SANG-EUI;KIM HA-JIN;KIM DONG-EARN;KIM DONG-OUK;PARK SUNG-HOON;BAE MIN-JONG;SON YOON-CHUL;CHU KUN-MO |
分类号 |
H05B3/00;G03G15/20;H05B3/10;H05B3/40 |
主分类号 |
H05B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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