| 摘要 |
<p>This present disclosure relates to a structural adhesive film suitable for bonding a first metal part and a second part, and in particular for hem flange bonding of a first metal part and second part. More specifically, the present disclosure is directed to a structural adhesive film comprising a thermosettable composition which comprises an epoxy compound having a selected average epoxy equivalent weight, a thermoplastic resin having a selected softening point, and an epoxy curing agent. The present disclosure further relates to a thermoset structural adhesive film obtainable by thermosetting of the structural adhesive film of the disclosure, and to a two-part assembly comprising such a thermoset structural adhesive film. In another aspect, the present disclosure is directed to a method for bonding a first metal part and a second part, in particular for hem flange bonding of a first metal part and second part.</p> |
