MANUFACTURING METHOD OF COPPER OXIDE FOR PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a copper oxide for a printed circuit board by the present invention comprises a dissolving step which manufactures a copper-dissolved solution by mixing 1 mole of 99% copper, 3-5 mole of an ammonia water, and 1-3 mole of ammonium carbonate and stirring it; a first filtering step removing insoluble components from the solution formed in the dissolving step; a copper oxide-manufacturing step which forms copper carbonate by additionally putting ammonium carbonate into the filtered solution and heating it up to 30-100°C after filling CO2 component; a second filtering step which manufactures copper carbonate in a wet cake shape by separating the copper carbonate from the solution; and a copper oxide-manufacturing step which manufactures copper oxide by heating the copper carbonate up to 300-800°C in an electric furnace. [Reference numerals] (S10) Dissolving step; (S20) First filtering step; (S30) Copper carbonate-manufacturing step; (S40) Second filtering step; (S50) Copper oxide-manufacturing step