FLIP-CHIP HYBRIDISATION OF TWO MICROELECTRONIC COMPONENTS USING A UV ANNEAL

摘要

This process for fabricating a microelectronic device comprising a first component (12) hybridised with a second component (14) by means of electrical interconnects consists in: producing first and second components (12, 14), the second component (14) being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; forming interconnecting elements (22) comprising copper oxide on the second component (14) in the locations provided for the interconnects; placing the first and second components (12, 14) one on the other; and applying ultraviolet radiation, through the second component (14), to the elements comprising copper oxide so as to implement an ultraviolet anneal converting the copper oxide into copper.