ELECTRONIC DEVICE HAVING A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

An electronic device includes a main board including a first ground pad, a semiconductor package electrically connected to the main board and separated from the main board, an upper conductive electromagnetism shielding member covering the upper and the lateral surface of the semiconductor package, and a lower conductive electromagnetism shielding member surrounding a separation space between the main board and the semiconductor package and electrically connected to the upper conductive electromagnetism shielding member and the first ground pad. The upper and the lower conductive electromagnetism shielding member can prevent an electromagnetic wave emitted from the semiconductor package.