| 摘要 |
<p>Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a is formed of a ceramic material S, has a square (rectangular) shape in plan view, and which has a front surface 2, a back surface 3, and side surfaces 4 each being located between the front surface 2 and the back surface 3, wherein each side surface 4 has a belt-like uneven surface 5 including a plurality of alternate and parallel convex portions 7 and concave portions 6 which are formed so as to extend along the front surface 2, and also has a fracture surface 8 located on a side toward the back surface 3.</p> |
