| 摘要 |
The embodiment includes a step of forming lower electrodes on a substrate, a step of forming a first stop layer on the lower electrodes, a step of forming a filling layer on the first stop layer, a step of forming a second stop layer on the filling layer, a step of forming a first interlayer dielectric on the second stop layer, a step of forming upper electrodes on the first interlayer dielectric, a step of forming a second interlayer dielectric on the upper electrodes, a step of forming a cavity by etching the first and the second interlayer dielectric, and a step of forming a contact ball in the cavity. |
