| 摘要 |
The present invention provides a substrate with a built-in electronic component, capable of preventing the substrate with the built-in electronic component from being deformed like twist and warpage due to a rigidity difference between a low rigid area and a high rigid area on a core layer. The substrate with the built-in electronic component receives an electronic component (12) in a plurality of receiving units (11a1) formed on the core layer (11a). A plurality of air gap parts (11a2) filled with insulators (11k) are installed on the core layer (11a). |
