发明名称 Wired circuit board
摘要 A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.
申请公布号 US8658903(B2) 申请公布日期 2014.02.25
申请号 US201113317365 申请日期 2011.10.17
申请人 KAMEI KATSUTOSHI;ICHINOSE KOUJI;SUGIMOTO YUU;NITTO DENKO CORPORATION 发明人 KAMEI KATSUTOSHI;ICHINOSE KOUJI;SUGIMOTO YUU
分类号 H05K1/00 主分类号 H05K1/00
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