发明名称 Circuit board including a heat radiating plate
摘要 A circuit board is provided with a plurality of arms and a heat radiation plate. The insulating substrate of the each of the arms includes: a passive element region to which a passive element is connected; an active element region to which an active element is connected; and a wiring region on which wiring lines of the element group are laid. In the each of the arms, the passive element region, the active element region and the wiring region align in a lengthwise direction of the insulating substrate, and the passive element region and the wiring region are arranged on both sides of the active element region which is located centrally.
申请公布号 US8659900(B2) 申请公布日期 2014.02.25
申请号 US201113096207 申请日期 2011.04.28
申请人 TAKAYANAGI TAKAHITO;OGURA MASAMI;KASAGI KOSUKE;HONDA MOTOR CO., LTD. 发明人 TAKAYANAGI TAKAHITO;OGURA MASAMI;KASAGI KOSUKE
分类号 H05K7/20;H01L23/34 主分类号 H05K7/20
代理机构 代理人
主权项
地址