| 摘要 |
An LED(Light Emitting Diode) package with a light-transmission housing is provided to dramatically reduce the loss of light by using the light-transmission housing as a light emission path. A housing(10) is provided with lead terminals for applying a current to an LED chip(2). An opening is formed on the housing. The LED chip is placed on the opening. A light-transmission encapsulation member(30) is filled in the opening to protect the LED chip. The housing is made of a light-transmission resin, thereby becoming a light emission path together with the light-transmission encapsulation member. The lead terminals are first and second lead frames(22,24) which are supported by the housing. The light-transmission encapsulation member is made of a first resin section of silicon for covering a peripheral of the LED chip, and a second resin section of epoxy being formed over the first resin section. |
