摘要 |
PURPOSE: An electromagnetic wave shielding film, the manufacturing method thereof, a printed circuit board which attached with electromagnetic wave shielding film and the manufacturing method thereof are provided to efficiently reduce the electromagnetic wave by improving the heat resistance. CONSTITUTION: A carrier film is adhered to one side of the insulation layer. A primer layer (3) is formed on the top surface of the insulation layer. The metal layer is formed on the top portion of the primer layer. The conductive adhesive layer (5) is formed on the top portion of the metal layer. All layers are dried and laminated. |