发明名称 ELECTROMAGNETIC WAVE SHIELD FILM AND PRINTED CIRCUITED BOARD ATTACHED SAID FILM AND THE MANUFACTURING METHOD THEREOF
摘要 PURPOSE: An electromagnetic wave shielding film, the manufacturing method thereof, a printed circuit board which attached with electromagnetic wave shielding film and the manufacturing method thereof are provided to efficiently reduce the electromagnetic wave by improving the heat resistance. CONSTITUTION: A carrier film is adhered to one side of the insulation layer. A primer layer (3) is formed on the top surface of the insulation layer. The metal layer is formed on the top portion of the primer layer. The conductive adhesive layer (5) is formed on the top portion of the metal layer. All layers are dried and laminated.
申请公布号 KR101361529(B1) 申请公布日期 2014.02.25
申请号 KR20120003714 申请日期 2012.01.12
申请人 发明人
分类号 B32B27/34;H05K3/28;H05K9/00 主分类号 B32B27/34
代理机构 代理人
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