| 摘要 |
PURPOSE: A highly integrated power module package is provided to prevent the breakdown of a device by using an integrated circuit including a low voltage lockout and an overcurrent protection function. CONSTITUTION: A DBC substrate has a first height. A power device (420) includes a thermistor. A control substrate has a second height higher than the first height. An outer lead (470) is connected to the DBC substrate and the control substrate respectively. A molding material (450) exposes the outer lead. |
