A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
申请公布号
US8659906(B2)
申请公布日期
2014.02.25
申请号
US201213442801
申请日期
2012.04.09
申请人
MCCLURE STEPHEN R.;BANKO JOSHUA D.;TERNUS JOHN P.;APPLE INC.