| 摘要 |
Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique. |
