| 摘要 |
Disclosed is an interposer assembly used for a probe for semiconductor inspection. The interposer assembly according to an embodiment of the present invention comprises: a substrate which is made of insulating material and has multiple through-holes; first and second elastic members which are separately located at the upper and lower parts of the through-holes respectively; a first contact member which is coupled to the first elastic member and whose one end protrudes from one end of the through-hole to the outside of the substrate; and a second contact member which is coupled to the second elastic member and whose one end protrudes from the other end of the through-hole to the outside of the substrate. According to the present invention, because a contact member is coupled to an elastic member to be detachable, damage to a connection can be reduced. Also, when a substrate is manufactured, an elastic member is fixed to the interior of the substrate, therefore, the elastic member and a contact member coupled thereto have a constant height, and as a result, the risk of contact failure can be considerably reduced. |
