发明名称 |
Test apparatus and test method |
摘要 |
Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card. |
申请公布号 |
US8659311(B2) |
申请公布日期 |
2014.02.25 |
申请号 |
US201113205646 |
申请日期 |
2011.08.09 |
申请人 |
SAKATA HIROSHI;MIYATA KEN;ADVANTEST CORPORATION |
发明人 |
SAKATA HIROSHI;MIYATA KEN |
分类号 |
G01R31/20 |
主分类号 |
G01R31/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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