发明名称 |
Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing same |
摘要 |
According to one embodiment, an integrated circuit device includes a plurality of interconnects and a contact via. The plurality of interconnects are arranged parallel to each other. The contact via is connected to the each of the interconnects. A protrusion is formed at a portion of each of the interconnects connected to the contact via to protrude in a direction of the arrangement. A recess is formed at a portion of the each of the interconnects separated from the portion having the protrusion to recede in the direction. The protrusion formed on one interconnect of two mutually-adjacent interconnects among the plurality of interconnects is opposed to the recess formed in one other interconnect of the two mutually-adjacent interconnects. The portion having the recess is separated from portions on two sides thereof and is separated also from the portion having the protrusion. |
申请公布号 |
US8659159(B2) |
申请公布日期 |
2014.02.25 |
申请号 |
US201113237825 |
申请日期 |
2011.09.20 |
申请人 |
SUDO GAKU;KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUDO GAKU |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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