发明名称 Eddy current sensor and polishing method and apparatus
摘要 An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.
申请公布号 US8657644(B2) 申请公布日期 2014.02.25
申请号 US201113313407 申请日期 2011.12.07
申请人 TADA MITSUO;TAKAHASHI TARO;EBARA CORPORATION 发明人 TADA MITSUO;TAKAHASHI TARO
分类号 B24B49/10 主分类号 B24B49/10
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