发明名称 |
Eddy current sensor and polishing method and apparatus |
摘要 |
An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate. |
申请公布号 |
US8657644(B2) |
申请公布日期 |
2014.02.25 |
申请号 |
US201113313407 |
申请日期 |
2011.12.07 |
申请人 |
TADA MITSUO;TAKAHASHI TARO;EBARA CORPORATION |
发明人 |
TADA MITSUO;TAKAHASHI TARO |
分类号 |
B24B49/10 |
主分类号 |
B24B49/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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