发明名称 |
Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device |
摘要 |
An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more. |
申请公布号 |
US8659157(B2) |
申请公布日期 |
2014.02.25 |
申请号 |
US201213477349 |
申请日期 |
2012.05.22 |
申请人 |
KIMURA YUTA;INOUE YASUSHI;MATSUMURA TAKESHI;NITTO DENKO CORPORATION |
发明人 |
KIMURA YUTA;INOUE YASUSHI;MATSUMURA TAKESHI |
分类号 |
H01L23/52;H01L21/20;H01L23/31;H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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