| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can suppress the occurrence and progress of cracks in a substrate.SOLUTION: A semiconductor device according to the present invention comprises: a substrate 12 on which a device 14 is formed or mounted on the surface; a back electrode 20 which is formed on the rear surface of the substrate 12 and has a compression stress; and a stress relaxation layer 18 which is formed on the surface of the substrate 12 so as to surround the device 14 and has a compression stress. |
