发明名称 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce poor mounting by mounting such components that are susceptible to positional deviation after being mounted, due to mounting of a component which is mounted later or board vibration by board transfer, earlier.SOLUTION: A component mounting device includes setting means for setting the board vibration sensitivity indicating the vibration sensitivity for a plurality of types of components, and mounting order determination means for determining the mounting order of components so that a component having a larger board vibration sensitivity is mounted on a board later than a component having a smaller board vibration sensitivity, when classifying a plurality of components by the magnitude of board vibration sensitivity.
申请公布号 JP2014036174(A) 申请公布日期 2014.02.24
申请号 JP20120177711 申请日期 2012.08.10
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 FUSHIMI SATOSHI;NAKADA TERUO;IZUMIHARA KOICHI
分类号 H05K13/04 主分类号 H05K13/04
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