发明名称 MACH-ZEHNDER MULTI-CHIP MODULE AND PACKAGING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a low-cost and simple multi-chip optical device composed of dissimilar materials that suppresses a phase error due to a gap and suppresses an influence of reflection return light, and to provide a packaging method of the optical device.SOLUTION: A Mach-Zehnder multi-chip module is an optical switch constituted of three chips comprising: a silicon optical circuit 101 including phase shifters 103 each provided to two waveguides; a quartz-based PLC 102a including a first directional coupler 106a connected with both ends of the phase shifters; and a quartz-based PLC 102b including a second directional coupler 106b. Respective waveguides close to input-output ports of the silicon optical circuit 101 and the quartz-based PLCs 102a and 102b are formed perpendicularly to a substrate end face, and emit propagation light perpendicularly to the substrate end face. Furthermore, the silicon optical circuit 101 and the quartz-based PLCs 102a and 102b are bonded by an adhesive 107 having refractive index equivalent to that of quartz so that gaps 108a to 108d are equal to each other.
申请公布号 JP2014035378(A) 申请公布日期 2014.02.24
申请号 JP20120175405 申请日期 2012.08.07
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 KATAYOSE SATOMI;HASHIZUME YASUAKI;NASU YUSUKE;ITOU MIKITAKA
分类号 G02B6/122 主分类号 G02B6/122
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