| 摘要 |
PROBLEM TO BE SOLVED: To solder an insertion mounting component surely to a printed circuit board.SOLUTION: The lead 22 of an insertion mounting component 21 is inserted into the through hole 31 of a printed circuit board 2, and the tip of the lead 22 is inserted into the recess 25 of a heat source 4. When vibrating the heat source 4, the lead 22 vibrates for the printed circuit board 2 thus narrowing the gap between the through hole 31 and the lead 22 periodically. When the gap between the through hole 31 and the lead 22 is narrowed, entry of a solder paste 37 melted by the heat source 4 is facilitated by capillarity. Since the solder paste 37 is led to the lower end of the through hole 31 as the lead 22 vibrates, generation of voids is prevented. |
