METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MOUNTING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component mounting board capable of preventing the formation of a fillet or bleeding when under-fill agent 16 injected into a region immediately below a mounted electronic component largely protrudes outside the external shape of the component, and preventing the generation of a portion which the under-fill agent 16 cannot enter.SOLUTION: The method for manufacturing an electronic component mounting board for mounting an electronic component on a wiring board, and for injecting under-fill agent 16 into a region between the wiring board and the electronic component includes: a process of disposing a contact angle adjustment site outside a region immediately below the mounted electronic component on the electronic component mounting side face of the wiring board; and a process of injecting the under-fill agent 16. The contact angle adjustment site is characterized such that a contact angle with respect to the under-fill agent 16 to be injected is adjusted from 90 degrees to 170 degrees.