| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding electronic components, which leaves a small number of impurity residues in a bonded part and has high bonding reliability.SOLUTION: In the method of bonding electronic components, a heat-bonding material (L) containing a metal particulate (P) having an average primary particle diameter of 2-500 nm, an organic dispersant (S) containing one or two kinds of polyhydric alcohol (A1) having two or more hydroxyl groups in a molecule is used, and two or more adherends are bonded by heating or heating under pressure. A bonding assisting material (H) containing one or two kinds of polyhydric alcohol (A2) having two or more hydroxyl groups in a molecule is disposed on at least one side of each of the bonding surface of the heat-bonding material (L) and the bonding surface of the adhered, and under this condition, the adherends are bonded by heating or heating under pressure. |
